๐ About Me
I am a Master student in the School of Computing at National University of Singapore (NUS), mentored by Dr. Wenjie Wang and Dr. Yongqi Li, under the supervision of Prof. Tat-Seng Chua. I received my Bachelorโs degree in 2023 from the Institute of Artificial Intelligence at Beihang University (BUAA).
My research focuses on Information Retrieval, Multimodal Learning, and LLM-based Agents.
I am actively seeking Ph.D. opportunities starting in 2025.
๐ฅ News
Oct 2023:ย I joined as a research intern.
Sep 2023:ย Our paper is accepted by Advanced Intelligent Systems.
Oct 2021:ย I joined Biomechanics and Soft Robotics Lab as a research intern.
๐ Publications
In the year of 2024:
Revolutionizing Text-to-Image Retrieval as Autoregressive Token-to-Voken Generation
Yongqi Li, Hongru Cai, Wenjie Wang, Leigang Qu, Yinwei Wei, Wenjie Li, Tat-Seng Chua.
Paper | Code
In the year of 2023:
An Aerial-Aquatic Hitchhiking Robot with Remora-Inspired Tactile Sensors and Thrust Vectoring Units
Lei Li, Wenbo Liu, Bocheng Tian, Peiyu Hu, Wenzhuo Gao, Yuchen Liu, Fuqiang Yang, Youning Duo, Hongru Cai, et al.
Paper | Code
๐ Experiences
NExT++, National University of Singapore.
Mainly works on Generative Retrieval and LLM-based Agents with Dr. Yongqi Li and Dr. Wenjie Wang.
Advisor: Prof. Tat-Seng Chua.
Oct 2023 - Present
Biomechanics and Soft Robotics Lab, Beihang University.
Mainly works on 3D Vision for Aerial-Aquatic Hitchhiking Robot with Dr. Lei Li.
Advisor: Prof. Li Wen.
Oct 2021 - Jun 2023
๐ Educations
Master of Computing (AI Track), School of Computing, Singapore.
Aug 2023 - Present
Bachelor of Artificial Intelligence, Institute of Artificial Intelligence, Beijing.
Sep 2019 - Jun 2023
๐ Professional Services
Reviewer of WWW 2025.
Reviewer of COLING 2025.
Subviewer of SIGIR 2024.
Program Committee Member of WWW 2024 - The 2nd Workshop on Recommendation with Generative Models.
๐ Honors and Awards
Excellent Conclusion of National College Students Innovation and Entrepreneurship Project, Nov 2022, Beijing.
Top Twelve Universities Joint Mechanical Engineering Academic Forum: Best Popularity Report, May 2022, Beijing.